OSFP-XD Test Fixture
- Series: Test Fixture - Brand: Te-lead
In an everchanging industry, new form factors are launched to support higher speeds like 800G and later, 1.6T. With the speed per lane increasing exponentially, the need for thermal and cooling tests also rises with new requirements and demands.
MultiLane is offering a OSFP-XD thermal load with a controller board, with the goal of emulating transceiver thermal behavior, but also to test cooling systems.
OSFP-XD MCB includes:
• MCB loss including the 3” MXPM70 cable is compliant with CEI-56G-VSR-NRZ and IEEE 802.3ck.
• CMIS GUI providing comprehensive approach to DUT interoperability, allowing users to access full CMIS implementation in modules. APIs available.
• I2C master driven from both on board microcontroller and/or external pin headers
• On-board LEDs display MSA output alarm states
• On-board buttons/jumpers for MSA input control signals
SI Details:
• The graph shows the loss of the MCB from OSFP-XD host connector, including PCB trace and MXPM70 connector to the 1.85mm connector on the end of the 3’’ cable.
• The MCB loss with a 3” MXPM70 cable is compliant with CEI-56G-VSR-NRZ and IEEE 802.3ck.
OSFP-XD HCB:
• OSFP-XD MSA Form Factor
• Compliant with IEEE802.3ck and CEI-56G-VSR-NRZ
• Built with high performance PCB Material
• High performance signal integrity traces
• Same low Insertion Loss for all channels
• HCB1 supports 8x112G TX and RX lanes
• HCB2 supports 8x112G TX and RX lanes
• High speed signals accessible through 2.4-mm or 1.85-mm connectors
